1N3017BUR-1/TR

Overview

The Microchip Technology 1N3017BUR-1/TR is a surface mount Zener diode with a nominal voltage of 7.5 V and a 5% tolerance. It operates within a junction temperature range of -55°C to +175°C and dissipates up to 1.0 W DC power. The device features a maximum Zener impedance of 4.0 Ohms at a test current of 34 mA, with a reverse leakage current of 125 µA at 5.7 V. It utilizes a DO-213AB (MELF) package.

Feature Summary

• Hermetically sealed glass MELF construction for high reliability
• Metallurgically bonded internal design for lower thermal resistance
• Qualified per MIL-PRF-19500/115 standards
• Leadless surface mount form factor

Applications

• High-density circuit board mounting
• Voltage regulation over broad operating ranges
• Low parasitic requirement applications
• Radiation-hardened environments

Procurement Notes

Verify the specific suffix against official documentation to confirm RoHS compliance status and tape-and-reel packaging configuration. Ensure the ordering code matches the required military qualification level. Confirm that the supplier provides traceability documentation consistent with the MIL-PRF-19500/115 standard requirements.

Selection Notes

Select this component when a hermetically sealed surface mount Zener diode is required for high-reliability or radiation-tolerant designs. The DO-213AB package offers a leadless alternative to traditional axial leads while maintaining metallurgical bonding. Verify that the 7.5 V breakdown voltage aligns with the specific circuit regulation needs.

Part Context

This part belongs to the 1N3016B through 1N3045B series, which are JEDEC registered devices adapted for surface mount technology. The series covers a wide Zener voltage range from 6.8 V to 110 V. These components serve as direct equivalents to their through-hole counterparts but utilize the DO-213AB outline for improved density.

Replacement Considerations

Direct replacements include other manufacturers' DO-213AB Zener diodes with matching 7.5 V ratings and 5% tolerances. Verify that any substitute meets the same hermetic sealing and thermal dissipation characteristics.