1N4099D-1/TR

Single Zener Diodes Overview

The Microchip Technology 1N4099D-1/TR is a 6.8 V Zener diode with ±1% voltage tolerance, housed in an axial-lead glass DO-35 package. It operates within a temperature range of -65°C to +175°C and features a maximum power dissipation of 500 mW. The device exhibits a maximum dynamic impedance of 200 Ohms at a test current of 250 µA, with a reverse leakage current of 1 µA at 5.2 V. Noise density is specified at 40 µV/√Hz.

Single Zener Diodes Feature Summary

• Internal metallurgical bond construction for high reliability
• Hermetically sealed glass DO-35 package
• Inherently radiation hard design

Single Zener Diodes Applications

• Voltage regulation over broad ranges of current and temperature
• High reliability applications requiring MIL-PRF-19500/435 qualification

Single Zener Diodes Procurement Notes

Verify the specific ordering suffix against official documentation to confirm compliance status and packaging format. Confirm that the 'TR' suffix indicates tape and reel packaging per EIA-296 standards. Ensure the 'D' designation matches the required 1% voltage tolerance for the intended circuit design.

Single Zener Diodes Selection Notes

Select this component when a precise 6.8 V reference with tight tolerance is required in an axial-lead form factor. Consider the low noise density specification for sensitive analog circuits. Evaluate the thermal derating requirements based on the expected ambient operating conditions and available copper pad area on the PCB.

Single Zener Diodes Part Context

This part belongs to the 1N4099-1 through 1N4135-1 series of 500 mW metallurgically bonded glass Zener diodes. The series offers voltages from 1.8 to 100 V with various tolerance options. Commercial versions are available alongside military-grade qualifications up to the JANS level.

Single Zener Diodes Replacement Considerations

Consult the manufacturer's datasheet for direct equivalents within the same series or cross-reference compatible JEDEC registered parts. Verify pinout compatibility and ensure replacement components meet the required radiation hardness and hermetic sealing specifications.