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Product Detailed Parameters
- Description：BRIDGE RECT 1P 400V 10A MODULE
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Diode Type：Single Phase
- Technology：Standard
- Voltage - Peak Reverse (Max)：400 V
- Current - Average Rectified (Io)：10:00 AM
- Voltage - Forward (Vf) (Max) @ If：1.2 V @ 10 A
- Current - Reverse Leakage @ Vr：10 µA @ 400 V
- Operating Temperature：-65°C ~ 160°C (TA)
- Mounting Type：Chassis, Stud Mount
- Package / Case：Module
- Supplier Device Package：Module
- Grade：-
- Qualification：-
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Overview
The Microchip Technology 1N4437 is a silicon bridge rectifier diode designed for high-reliability applications. It features a hermetically sealed metal package with four terminals and supports a maximum average forward rectified current of 10 A at a peak repetitive reverse voltage of 400 V. The device exhibits a maximum non-repetitive peak forward surge current of 100 A and a maximum forward voltage drop of 1.2 V. It operates within a junction temperature range from -65 °C to +160 °C, ensuring stable performance in demanding environments.
Feature Summary
- Hermetically sealed metal package construction for environmental protection
- Single-phase bridge rectifier configuration with four internal elements
- High thermal stability suitable for extreme operating temperatures
Applications
- Military aerospace power supplies
- Avionics systems requiring radiation-hardened components
- Industrial equipment with strict reliability standards
Procurement Notes
Verify the specific suffix (e.g., FS) against the datasheet to confirm hermetic sealing and material specifications. Ensure the component meets MIL-PRF-19500 requirements if applicable. Check RoHS compliance status as military-grade parts may differ from commercial standards. Confirm package dimensions match the O-MUPF-D4 specification before integration.
Selection Notes
Select this component when hermetic sealing and high surge current capability are required. Compare the 10 A rating against system load requirements. Consider the 400 V reverse voltage margin for transient spikes. Evaluate the metal package thermal dissipation capabilities versus PCB-mounted alternatives for space-constrained designs.
Part Context
This part belongs to Microchip's legacy discrete semiconductor portfolio, often associated with Microsemi heritage products. It serves as a ruggedized alternative to standard plastic-packaged bridge rectifiers. The series is typically utilized in sectors where failure rates must be minimized through superior packaging integrity.
Replacement Considerations
Direct substitutes include other hermetically sealed bridge rectifiers from manufacturers like Vishay or STMicroelectronics meeting identical MIL-PRF-19500 specs. Verify pinout compatibility and thermal resistance values before substitution.
