1N4739AG/TR

Overview

The Microchip Technology 1N4739AG/TR is a single silicon Zener diode designed for voltage regulation applications. It features a nominal Zener voltage of 9.1 V with a tolerance of 5%. The device operates in the DO-41-2 axial through-hole package and dissipates up to 1 W of power. Key electrical parameters include a maximum reverse leakage current of 10 uA, a Zener impedance of 5 Ohms, and a test current of 28 mA. It supports a wide operating temperature range from -65 C to +175 C.

Feature Summary

• Provides stable voltage regulation using a single unidirectional silicon junction.
• Capable of handling high thermal loads with a 1 W power dissipation rating.
• Engineered for reliable operation across extreme environmental temperatures.

Applications

• General-purpose voltage reference circuits
• Overvoltage protection stages
• Power supply regulation modules

Procurement Notes

Verify the specific suffix configuration against official datasheets to ensure compatibility with required packaging and compliance standards. Confirm that the component meets all necessary environmental regulations for the intended deployment region before finalizing procurement decisions.

Selection Notes

Select this component when a precise 9.1 V reference is required within a standard axial package. Ensure the circuit design accommodates the specified 5% voltage tolerance and that the thermal management strategy supports the 1 W dissipation limit under worst-case operating conditions.

Part Context

This part belongs to the established 1N47xx series of Zener diodes manufactured by Microchip Technology. It utilizes the DO-41 glass encapsulation style, which is widely recognized for its robustness in through-hole mounting applications. The series offers various voltage options while maintaining consistent physical dimensions and performance characteristics.

Replacement Considerations

Cross-reference with other manufacturers offering DO-41 packaged Zener diodes rated at 9.1 V and 1 W. Verify pinout compatibility and thermal resistance values to ensure seamless integration into existing designs without requiring layout modifications.