1N4747UR-1/TR

Overview

The Microchip Technology 1N4747UR-1/TR is a surface mountable 1.0 W glass Zener diode in the DO-213AB MELF package. It provides a nominal Zener voltage of 20 V with a standard tolerance of ±5%. The device operates within a temperature range of -65°C to +175°C and features a maximum dynamic impedance of 22 Ω at a test current of 12.5 mA. It includes a tape and reel option for automated assembly.

Feature Summary

• Hermetically sealed glass construction suitable for high reliability applications
• Surface mount leadless design ideal for high density mounting
• Inherently radiation hard per MicroNote 050

Applications

• Voltage regulation in high density electronic circuits
• High reliability systems requiring source control drawings
• Applications demanding low parasitic requirements

Procurement Notes

Verify that the specific part number matches the required voltage tolerance and packaging configuration. Confirm RoHS compliance status if applicable, as standard versions may differ from e3 suffix variants. Ensure the supplier provides documentation confirming the hermetic seal integrity and adherence to the specified JEDEC outline dimensions for proper integration.

Selection Notes

Select this component when a 1 W power dissipation rating and a 20 V regulation point are required in a surface mount form factor. Consider the DO-213AB package dimensions for PCB layout compatibility. Evaluate thermal derating curves if operating near the upper temperature limits or in confined spaces without adequate heat sinking.

Part Context

This device belongs to the 1N4728AUR through 1N4764AUR series of surface mount glass Zener diodes. It serves as the SMD equivalent to the axial-leaded 1N4747A in the DO-41 package, offering similar electrical characteristics while enabling compact board designs. The series covers a wide voltage range from 3.3 V to 100 V.

Replacement Considerations

Direct equivalents include the 1N4747AUR (bulk) and the axial 1N4747A. Surface mount alternatives like SMAJ4747A exist but differ in package size and potentially thermal performance. Verify pinout polarity and physical footprint compatibility before substitution.