1N4749AUR

Overview

The Microchip Technology 1N4749AUR is a high-reliability Zener diode designed for voltage regulation applications. It features a nominal Zener voltage of 24 V with a tolerance of 5% and a maximum power dissipation of 1 W. The device utilizes silicon technology and is housed in a hermetically sealed DO-213AB (MELF-2) glass package, ensuring unidirectional operation. Key electrical characteristics include a test current of 10.5 mA, a maximum reverse leakage current of 100 nA, and a Zener impedance of 25 Ohms. It supports an operating temperature range from -65°C to +175°C.

Feature Summary

• Hermetically sealed glass MELF package for enhanced environmental protection
• High reliability construction suitable for demanding operational conditions
• Wide thermal operating range extending up to 175°C

Applications

• Voltage reference circuits requiring stable regulation
• Overvoltage protection in sensitive electronic systems
• Clamping applications in aerospace and defense equipment

Procurement Notes

Verify the specific manufacturer source, as Microchip acquired Microsemi's assets which originally produced this part number. Confirm that the received component matches the DO-213AB package style and hermetic sealing specifications. Ensure compliance with required military or industrial standards if the application demands high reliability. Check for RoHS status variations depending on the production batch and supplier.

Selection Notes

Select this component when a hermetically sealed surface-mount Zener diode is required for high-reliability environments. The 1N4749AUR offers superior thermal stability compared to standard plastic packages. Consider the 24 V rating and 1 W power dissipation limits against circuit requirements. The wide temperature range makes it suitable for extreme condition deployments where standard commercial grade parts may fail.

Part Context

This component belongs to the 1N47xx series of Zener diodes, widely used for voltage regulation. The 'AUR' suffix typically denotes a specific tape-and-reel packaging format within the Microchip/Microsemi portfolio. As a successor to legacy discrete designs, it maintains compatibility with established circuit topologies while offering modern surface-mount integration capabilities for automated assembly processes.