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The Microchip Technology 1N5359E3/TR8 is a silicon 5-watt Zener diode from the JEDEC registered 1N5333-5388B series. It provides voltage regulation at a nominal Zener voltage of 24 volts with a ±5% tolerance, indicated by the 'B' suffix. The device operates within a temperature range of -65°C to +150°C and features a void-free transfer molded thermosetting epoxy body meeting UL94V-0 standards. Electrical characteristics include a maximum dynamic impedance of 3.5 ohms at a test current of 50 mA and a maximum reverse current of 0.5 µA. The component is RoHS compliant, as denoted by the 'e3' suffix, and is supplied in tape and reel packaging per EIA-296 standards.
Verify that the ordering suffix matches the required specifications: 'TR' indicates tape and reel packaging, while 'e3' confirms RoHS compliance. Ensure the 'B' suffix aligns with the necessary ±5% voltage tolerance. Confirm the manufacturer source is Microchip Technology or authorized distributors to guarantee authenticity and access to current datasheets. Check for any specific military screening prefixes if environmental ruggedness is required.
Select this component when a 24-volt Zener reference with 5-watt capability is needed. The B suffix ensures a standard 5% tolerance suitable for general regulation tasks. Consider the thermal resistance of 25°C/W junction-to-lead for heat sinking requirements. Verify that the axial lead format fits the PCB layout constraints compared to surface mount equivalents like SMBJ5359B.
This part belongs to the Microsemi Scottsdale Division's 1N5333B through 1N5388B series of silicon 5-watt Zener diodes. The series offers a wide selection of voltages from 3.3V to 200V. The 1N5359B specifically targets the 24V regulation niche within this family. The e3 suffix denotes lead finish compatibility with RoHS directives, replacing older tin-lead terminations while maintaining solderability per MIL-STD-750.
Surface mount equivalents such as SMBJ5359B or SMBG5359B are available from the same manufacturer. These offer identical electrical performance in different package formats. Verify pinout compatibility and thermal management differences between axial leads and surface mount variants before substitution.