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The Microchip Technology 1N5371AE3/TR12 is a silicon 5.0-watt Zener diode from the JEDEC registered 1N5333-5388B series, manufactured by Microsemi. It provides voltage regulation at a nominal Zener voltage of 60 V with a ±10% tolerance, indicated by the 'A' suffix. The device operates within a temperature range of -65°C to +150°C and features an axial lead T-18 package. Electrical characteristics include a maximum dynamic impedance of 40 Ohms and a maximum reverse current of 0.5 µA. The component is RoHS compliant (e3 suffix) and available in tape and reel packaging (TR suffix).
Verify the specific ordering suffixes against official documentation to confirm compliance requirements and packaging format. The 'e3' suffix indicates RoHS compliance, while 'TR' denotes tape and reel packaging. Confirm that the manufacturer designation aligns with current corporate structures, as historical data may reference Microsemi. Ensure the component meets all environmental and screening standards required for the intended application before procurement.
Select this component when a 60 V Zener voltage with ±10% tolerance is required for 5-watt power dissipation applications. Consider the T-18 axial package for through-hole mounting constraints. Evaluate thermal management needs, as steady-state power dissipation depends on heat sinking and ambient temperature conditions. Verify that the dynamic impedance and leakage current specifications meet the circuit's precision requirements.
This part belongs to the 1N5333B through 1N5388B series of silicon 5-watt Zener diodes. The series offers a wide selection of voltages from 3.3 V to 200 V with various tolerance options identified by suffix letters. These plastic encapsulated devices are designed for high maximum DC currents with adequate heat sinking and feature low thermal resistance.
Direct substitutes within the same series include other 1N53xx variants with different voltage ratings but identical power and package specifications. Cross-reference with SMBJ or SMBG surface mount equivalents if board space requires a change in form factor. Verify that any replacement maintains the required voltage tolerance and thermal performance characteristics.