SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Vishay 1N5406-E3/73 is a general-purpose plastic rectifier diode in the DO-201AD package. It features a maximum repetitive peak reverse voltage of 600 V and a maximum average forward rectified current of 3.0 A at an ambient temperature of 25 °C with a 0.5-inch lead length. The device supports a peak forward surge current of 200 A under single half-sine-wave conditions. Electrical characteristics include a maximum instantaneous forward voltage of 1.2 V at 3.0 A, a maximum DC reverse current of 5.0 μA at rated blocking voltage, and a typical junction capacitance of 30 pF. Operating temperatures range from -50 °C to +150 °C.
Verify the specific ordering suffix against official documentation to confirm packaging details. The /73 designation indicates ammo pack packaging with a base quantity of 1000 units. Confirm compliance requirements such as RoHS directives and material categorization standards before procurement. Ensure technical specifications align with application thermal and electrical constraints.
Select this component for standard rectification tasks requiring a 600 V rating and 3 A continuous current capacity. Consider the DO-201AD through-hole package for manual or standard automated assembly processes. Evaluate thermal resistance and derating curves if operation exceeds 25 °C ambient temperature. Verify that the 200 A surge current rating meets circuit transient requirements.
This part belongs to the 1N5400 series of general-purpose silicon rectifiers manufactured by Vishay General Semiconductor. The series covers reverse voltages from 50 V to 1000 V while maintaining a consistent 3.0 A average forward current rating. The E3 suffix denotes RoHS compliance and lead-free terminals. The 1N5406 variant specifically targets 600 V applications within this standardized product family.
Compatible substitutes within the same series include 1N5400 through 1N5408 variants sharing identical mechanical and electrical ratings except for reverse voltage. Cross-reference datasheets to ensure exact matching of package dimensions and terminal solderability standards.