1N5519UR-1

Overview

The 1N5519UR-1 is a low voltage surface mount Zener diode manufactured by Microchip Technology. It features a nominal breakdown voltage of 3.6V with a tolerance of ±20%. The device is rated for a power dissipation of 500 mW and utilizes silicon as the semiconductor material. It is housed in a DO-213AA (MELF-2) glass package, designed for hermetic sealing. The component is unidirectional and includes an internal metallurgical bond option, indicated by the '-1' suffix, which supports military qualification standards.

Feature Summary

• Hermetically sealed glass MELF package construction
• Internal metallurgical bonding for enhanced reliability
• Low reverse leakage characteristics
• Surface mount design for automated assembly

Applications

• Voltage regulation in low voltage circuits
• Avalanche diode applications requiring stable reference voltages
• Military and aerospace electronic systems
• High-reliability surface mount assemblies

Procurement Notes

Verify that the part number includes the '-1' suffix to confirm the presence of the internal metallurgical bond, which is critical for military-grade specifications. Ensure the procurement documentation explicitly states compliance with JAN, JANTX, or JANTXV qualifications if required for the specific application environment. Confirm the package type is DO-213AA to match footprint requirements.

Selection Notes

Select this component when a hermetically sealed, surface-mount Zener diode with a 3.6V breakdown is required. The internal metallurgical bond distinguishes it from standard commercial versions, making it suitable for harsh environments. Consider the 500 mW power rating and 20% tolerance when designing the biasing network. Verify that the DO-213AA package dimensions fit the available PCB space.

Part Context

This device belongs to the 1N5518BUR-1 through 1N5546BUR-1 series of low voltage surface mount avalanche diodes. The series offers various voltage options ranging from 3.3 to 33 volts. The 'UR' designation typically indicates a specific tape and reel packaging format, while the '-1' suffix denotes the metallurgically bonded construction. This family is widely used in applications demanding high reliability and radiation hardness.

Replacement Considerations

Direct substitutes include other parts within the same Microchip series with matching voltage ratings, such as variants ending in BUR-1. Cross-brand replacements must verify identical DO-213AA package dimensions, 3.6V breakdown voltage, and hermetic sealing capabilities. Ensure any substitute also meets the required military qualification standards if applicable.