1N5522BUR-1/TR

Overview

The 1N5522BUR-1/TR is a single Zener diode manufactured by Microchip Technology, designed for voltage regulation applications. It features a nominal Zener voltage of 4.7 V with a tolerance of 5%. The device operates in the DO-213AA-2 surface-mount package and supports a maximum power dissipation of 500 mW. Electrical characteristics include a maximum reverse leakage current of 2 µA at specified conditions and a Zener impedance of 26 Ohms. The component is rated for operation within an ambient temperature range from -65 °C to +175 °C.

Feature Summary

• Provides stable voltage regulation using silicon Zener breakdown mechanisms
• Utilizes hermetically sealed glass encapsulation for environmental protection
• Supports automated surface-mount assembly processes via reel packaging

Applications

• Voltage reference circuits requiring precise potential levels
• Overvoltage protection stages in sensitive electronic systems
• Clamping applications for signal line stabilization

Procurement Notes

Verify the specific suffix configuration against official Microchip documentation to ensure compatibility with required testing currents and impedance values. Confirm that the DO-213AA-2 package dimensions align with the target PCB footprint. Cross-reference the manufacturing date code and lot traceability requirements with project specifications before finalizing procurement orders.

Selection Notes

Select this component when a 4.7 V regulation point is required in a compact surface-mount form factor. Ensure the circuit design accommodates the 500 mW thermal dissipation limit under worst-case operating conditions. Verify that the 5% voltage tolerance meets the system's accuracy requirements without necessitating external trimming or calibration adjustments.

Part Context

This part belongs to the Microchip 1N5522 series of Zener diodes, which are engineered for robust performance in harsh environments. The BUR-1 designation indicates a specific manufacturing variant optimized for reliability. The TR suffix denotes tape-and-reel packaging suitable for high-volume automated placement equipment.

Replacement Considerations

Consult official Microchip substitution guides for verified equivalents. Generic replacements may differ in leakage current or thermal resistance.