1N5523BUR-1E3/TR

Overview

The 1N5523BUR-1E3/TR is a single Zener diode manufactured by Microchip Technology, designed for surface mount applications. It features a DO-213AA-2 package and operates within a temperature range of -65°C to +175°C. The device provides a nominal Zener voltage of 5.1 V with a tolerance of 5%. Key electrical parameters include a maximum power dissipation of 500 mW, a test current of 5 mA, and a maximum reverse leakage current of 2 µA. The dynamic impedance is specified at 26 Ohms, with a forward voltage of 1.1 V at 200 mA.

Feature Summary

• Metallurgically bonded glass construction for enhanced reliability
• Surface mount design in a compact DO-213AA-2 package
• Extended high-temperature operation capability up to 175°C

Applications

• Voltage regulation in industrial control systems
• Reference voltage sources in precision measurement circuits
• Overvoltage protection in automotive electronics

Procurement Notes

Verify the specific suffixes on the component marking against the official datasheet to confirm the metallurgical bond and lead-free status. Ensure the ordering quantity aligns with the reel packaging specifications provided by the manufacturer. Cross-reference the part number with the latest Microchip Technology documentation to validate compliance with current environmental standards before finalizing procurement.

Selection Notes

Select this component when a surface mount Zener diode with high-temperature stability is required. The DO-213AA-2 package offers a smaller footprint compared to axial leads while maintaining robust performance. Consider the 5% voltage tolerance and 500 mW power rating to ensure compatibility with the target circuit's voltage regulation and thermal management requirements.

Part Context

This component belongs to the 1N55xx series of low-voltage avalanche Zener diodes produced by Microchip Technology. The series includes various voltage options packaged in both axial-leaded and surface-mount configurations. The BUR-1E3 designation indicates a specific surface-mount variant with metallurgical bonding and lead-free composition, catering to modern assembly processes requiring high reliability.

Replacement Considerations

Consult Microchip Technology documentation for verified equivalent part numbers. Surface mount equivalents within the same series may be available depending on the required voltage tolerance and package constraints.