1N5527B/TR

Overview

The Microchip Technology 1N5527B/TR is a low voltage avalanche Zener diode rated at 0.5 W, housed in an axial-lead glass DO-35 (DO-204AH) package. It provides a nominal Zener voltage of 7.5 V with a ±5% tolerance and a maximum dynamic impedance of 35 Ohms at a test current of 1 mA. The device operates within a junction temperature range of -65°C to +175°C and features a maximum reverse leakage current of 6 µA at 6.8 V.

Feature Summary

• Provides stable voltage regulation across a broad operating current and temperature range
• Features hermetically sealed axial-lead glass construction for reliable performance
• Offers minimal capacitance characteristics suitable for sensitive circuit applications

Applications

• Voltage regulation over broad operating currents
• Temperature-compensated reference circuits
• Protection against electrostatic discharge events

Procurement Notes

Verify the specific suffix configuration when ordering to ensure compliance with required voltage tolerances and packaging formats. Confirm that the selected variant meets all necessary environmental standards and qualification levels for your intended application environment before finalizing procurement decisions.

Selection Notes

Select this component based on its precise 7.5 V breakdown voltage and tight ±5% tolerance requirements. Ensure the chosen package style aligns with your board layout constraints and verify that the thermal dissipation capabilities are sufficient for your steady-state power conditions.

Part Context

This part belongs to the 1N5518 through 1N5546 series of low voltage avalanche Zener diodes manufactured by Microchip Technology. The series offers a wide selection of voltages from 3.3 to 33 volts with various tolerance options. These components are designed for robust voltage regulation in demanding electronic environments.

Replacement Considerations

Equivalent parts include 1N5527C and 1N5527D, which offer tighter voltage tolerances of ±2% and ±1% respectively. Verify compatibility regarding package dimensions and electrical parameters before substituting these variants into existing designs.