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The Microchip Technology 1N6078US/TR is a surface-mount ultrafast recovery glass power rectifier designed for high-reliability applications. It features a voidless hermetically sealed package with an internal Category I metallurgical bond. The device operates within a junction temperature range of -65°C to +155°C and supports a peak forward surge current of 75 Amps at 25°C. It provides an average rectified forward current of 6.0 Amps at a case temperature of 70°C, with a working peak reverse voltage of 150 Volts.
Verify the specific datasheet revision and manufacturer origin, as historical inventory may include variants with solid silver end caps instead of tin/lead finishes. Confirm that the TR suffix indicates tape and reel packaging compliant with EIA-481-B standards. Ensure compatibility with solder temperatures up to 260°C for ten seconds maximum during assembly processes.
Select this component when high reliability and radiation hardness are required in a surface-mount form factor. The 1N6078US/TR offers a 150V reverse voltage rating suitable for medium-voltage rectification. Its ultrafast recovery characteristics make it appropriate for high-frequency switching environments where minimizing reverse recovery time is critical for system efficiency.
This part belongs to the 1N6073US through 1N6081US series of ultrafast recovery rectifiers manufactured by Microsemi's Scottsdale Division. The series covers current ratings from 3 to 12 Amps and reverse voltages from 50 to 150 Volts. The 1N6078US/TR specifically utilizes Package E (D-5B) and shares common structural features with its series counterparts, including voidless-glass construction.
Axial-leaded equivalents such as 1N6078 are available by removing the US suffix. Other series members like 1N6076US or 1N6077US offer different current or voltage ratings within the same package style.