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Product Detailed Parameters
- Description：DIODE STANDARD 75V 300MA D5D
- Series：-
- Mfr：Microchip Technology
- Package：Tape & Reel (TR)
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：75 V
- Current - Average Rectified (Io)：300mA
- Voltage - Forward (Vf) (Max) @ If：1 V @ 200 mA
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：4 ns
- Current - Reverse Leakage @ Vr：100 nA @ 50 V
- Capacitance @ Vr, F：-
- Mounting Type：Surface Mount
- Package / Case：SQ-MELF, D
- Supplier Device Package：D-5D
- Operating Temperature - Junction：-65°C ~ 175°C
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Overview
The Microchip Technology 1N6640US/TR is a small signal switching diode designed for surface mount applications. It features a single configuration within the D-5D-2 package. Key electrical parameters include a peak reverse voltage of 75 V and a forward current rating of 300 mA. The device exhibits a fast recovery time of 4 ns with a maximum surge current capability of 2.5 A. Forward voltage is specified at 1 V, while reverse current remains low at 100 nA. Operating temperatures range from -65 C to +175 C.
Feature Summary
- Fast switching performance suitable for high-speed digital circuits
- Extended temperature operation up to 175 C
- Surface mount construction in compact SQ SMT package
Applications
- Signal processing circuits
- Computer diode applications
- High-speed switching logic interfaces
Procurement Notes
Verify the specific suffix designation against official documentation to confirm tape and reel packaging requirements. Ensure the ordered part matches the exact voltage and current ratings required by the circuit design. Cross-reference the manufacturer number with the latest datasheet revisions to validate pinout compatibility and thermal characteristics before integration into production systems.
Selection Notes
Select this component when a small signal switching diode with rapid recovery characteristics is required for surface mount assembly. The wide operating temperature range supports demanding environmental conditions. Verify that the 300 mA forward current and 75 V reverse voltage limits align with the specific circuit load and voltage stress profiles during normal and transient operations.
Part Context
This component belongs to the Microchip Technology diode portfolio, specifically categorized under small signal switching devices. It utilizes silicon technology housed in a non-cavity glass package structure. The product line includes various variants compliant with military specifications, offering metallurgically bonded constructions for enhanced reliability in critical electronic systems.
Replacement Considerations
Consult official substitution lists for compatible equivalents. Verify that any alternative part maintains identical package dimensions, pin configurations, and electrical thresholds to ensure seamless circuit integration without redesign.
