1N6642UB2

1N6642UB2

$13.85
  • Description:DIODE GEN PURPOSE
  • Series:*
  • Mfr:Microchip Technology
  • Package:Bulk

SKU:fff6c31fe479 Category: Brand:

  
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Product Detailed Parameters

  • Description:DIODE GEN PURPOSE
  • Series:*
  • Mfr:Microchip Technology
  • Package:Bulk
  • Technology:-
  • Voltage - DC Reverse (Vr) (Max):-
  • Current - Average Rectified (Io):-
  • Voltage - Forward (Vf) (Max) @ If:-
  • Speed:-
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:-
  • Capacitance @ Vr, F:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Operating Temperature - Junction:-

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1N6642UB2

Overview

The Microchip Technology 1N6642UB2 is a small signal switching diode designed for surface mount applications. It features a 75 V peak reverse voltage and a 300 mA forward current rating. The device utilizes a 3-pin ceramic package suitable for SMD/SMT mounting. Key electrical characteristics include a 5 ns recovery time, a 1.2 V forward voltage, and a 25 nA reverse current. It operates within a temperature range of -65°C to +175°C.

Feature Summary

  • Surface mount hermetic construction in a 3-pin ceramic package
  • Ultrafast switching capability with 5 ns recovery time
  • Low leakage off-state current of 25 nA at rated voltage
  • High thermal reliability supporting operation up to 175°C

Applications

  • Signal or computer diode circuits
  • High frequency rectification
  • Fast switching applications

Procurement Notes

Verify the specific suffix 'UB2' against the manufacturer's official datasheet to confirm the exact pinout and package dimensions. Ensure the component meets all required environmental standards for your specific deployment. Confirm that the 3-pin ceramic configuration aligns with your PCB layout constraints before finalizing procurement.

Selection Notes

Select this component when a hermetic surface mount switching diode is required. It is appropriate for designs needing high-temperature stability and fast recovery times. Consider the 3-pin ceramic footprint compatibility during the initial schematic capture phase to ensure seamless integration into the target circuit board.

Part Context

This part belongs to the Microchip Technology small signal switching diode family. It shares core electrical specifications with through-hole variants like the 1N6642 but differs in physical packaging. The UB2 designation specifically indicates the surface mount ceramic construction intended for automated assembly processes.

Replacement Considerations

Direct substitutes may include other hermetic surface mount switching diodes from the same series. Verify equivalent voltage, current, and recovery time ratings. Cross-reference the 3-pin ceramic footprint with alternative manufacturers to ensure mechanical compatibility.

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$13.85
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