1N6673

Overview

The Microchip Technology 1N6673 is a general-purpose rectifier diode array housed in a TO-254 package. It features a common cathode configuration with two diodes per unit. The device supports a maximum DC reverse voltage of 400 V and an average forward current of 15 A per diode. Key electrical parameters include a forward voltage of 1.35 V at 10 A, a reverse leakage current of 50 µA at 320 V, and a reverse recovery time of 35 ns. The component utilizes standard technology and is designed for through-hole mounting.

Feature Summary

• Common cathode dual diode configuration for efficient circuit design
• High current handling capability with 15 A average forward current rating
• Rapid reverse recovery characteristics suitable for switching applications

Applications

• General purpose rectification in power supply circuits
• Freewheeling diodes in inductive load protection
• DC-AC conversion stages requiring high current capacity

Procurement Notes

Verify the specific manufacturer source, as historical data indicates production by both Microsemi and Microchip Technology. Confirm RoHS compliance status, as some records indicate non-compliance. Ensure the TO-254 package variant matches the required PCB footprint. Check for active lifecycle status versus discontinued availability from third-party distributors to guarantee long-term supply chain stability.

Selection Notes

Select this component when a robust, high-current rectifier array is required for through-hole assembly. The 400 V rating suits medium-voltage AC line applications. Consider the 35 ns reverse recovery time for frequency requirements. Compare against alternatives if surface-mount solutions are preferred or if stricter environmental regulations mandate RoHS-compliant variants within the same family.

Part Context

The 1N6673 belongs to the broader category of discrete semiconductor diode arrays manufactured by Microchip Technology. It serves as a replacement or equivalent for legacy parts originally produced under the Microsemi brand. The TO-254 package provides mechanical stability and thermal dissipation advantages over smaller surface-mount packages, making it suitable for industrial and automotive power electronics environments.

Replacement Considerations

Public confirmed substitute part numbers are not explicitly listed in the provided documentation. Users should consult official Microchip cross-reference guides for direct equivalents. Verify pinout compatibility and thermal resistance values when substituting with similar TO-254 dual diode arrays from other manufacturers.