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The Microchip Technology 1N6818R is a hermetically sealed, low-profile ceramic surface mount power Schottky diode. It features a tungsten/platinum schottky barrier for very low forward voltage drop and an oxide passivated structure for very low leakage currents. Designed for high-current applications, it offers a 45V reverse voltage rating and supports a 75A average rectified current. The component utilizes a ThinKey3 package with low inductance and thermal resistance.
Verify the manufacturer origin, as the part was originally associated with Microsemi Corporation before acquisition by Microchip Technology. Confirm the specific package variant (ThinKey3) and polarity configuration (standard strap) matches your design requirements. Ensure the datasheet version aligns with the current product line to avoid discrepancies in electrical specifications or mechanical dimensions during integration.
Select this component when low forward voltage drop and high current handling are critical for efficiency. The hermetic ceramic construction suits environments requiring robust sealing against moisture and contaminants. Consider the ThinKey3 package constraints for PCB layout and thermal management strategies, ensuring adequate heat dissipation paths are designed around the low thermal resistance characteristics of the device.
This device belongs to the 1N68xx series of low voltage drop Schottky diodes manufactured by Microchip Technology. It shares family characteristics such as oxide passivation and ceramic packaging with related parts like the 1N6815 and 1N6819. The series is designed for general-purpose rectification where low leakage and high reliability are prioritized over standard silicon junction performance.
Direct substitutes within the same series include the 1N6815 and 1N6819, which share similar hermetic ceramic packages and Schottky technology. Verify that the replacement part's voltage and current ratings meet or exceed the original design specifications. Cross-reference datasheets to ensure compatibility with existing thermal and mechanical constraints.