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1N749A BK TIN/LEAD is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Central Semiconductor Corp. Its product description is 4.3V 500MW TH DIODE-ZENER SINGLE. Review the specifications below when checking this part for your BOM.
The 1N749A BK TIN/LEAD is a single Zener diode manufactured by Central Semiconductor Corp. It features a nominal Zener voltage of 6.8 V with a 5% tolerance and a power dissipation rating of 250 mW. The device operates within a temperature range of -65°C to +200°C and utilizes a DO-35-2 through-hole package. Key electrical characteristics include a maximum reverse leakage current of 10 µA, a Zener impedance of 200 ohms, and a test current of 5.5 mA.
Verify the specific ordering suffix against manufacturer documentation to confirm lead-free status or tin/lead composition. Confirm that the DO-35-2 package dimensions match your PCB layout requirements. Ensure the 250 mW power rating is sufficient for your application's thermal conditions. Cross-reference the 6.8 V Zener voltage and 5% tolerance with your design specifications before finalizing procurement.
Select this component when a precise 6.8 V reference is required in a compact axial package. The high maximum operating temperature of +200°C makes it suitable for harsh industrial environments. Consider the 200 ohm Zener impedance for noise-sensitive applications where lower impedance might be preferred. Verify that the 10 µA reverse leakage current meets your circuit's isolation requirements.
This part belongs to the 1N4099 series of Zener diodes produced by Central Semiconductor Corp. The series offers various voltage ratings within the DO-35 form factor. The 1N749A designation specifically identifies the 6.8 V variant within this product line, sharing common packaging and thermal characteristics with other members of the family.
Direct substitutes must maintain the 6.8 V Zener voltage, 250 mW power rating, and DO-35 package. Verify compatibility regarding Zener impedance and reverse leakage current specifications. Check for equivalent thermal performance and pinout alignment to ensure seamless integration into existing designs without modification.
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