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1N957B TR PBFREE is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Central Semiconductor Corp. Its product description is DIODE ZENER 6.8V 500MW DO35. Review the specifications below when checking this part for your BOM.
The 1N957B TR PBFREE is a silicon Zener diode manufactured by Central Semiconductor Corp. It features a nominal Zener voltage of 27 V with a tolerance of ±5%. The device is rated for a maximum power dissipation of 500 mW and operates within a temperature range of -65°C to +200°C. It utilizes a DO-35 axial through-hole package. Key electrical characteristics include a reverse leakage current of 100 µA at 21 V, a forward voltage of 1.1 V at 200 mA, and a maximum impedance of 41 ohms.
Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct packaging configuration. Confirm RoHS compliance status and environmental declarations prior to finalizing procurement orders. Cross-reference the manufacturer part number with distributor catalogs to validate availability and lead times. Ensure that the selected component matches the required voltage and power specifications for the intended design application.
Select this component when a stable 27 V reference is required in through-hole designs. Consider the 500 mW power rating and DO-35 package constraints for thermal management. Evaluate the ±5% tolerance against circuit precision requirements. Verify compatibility with operating temperatures up to 200°C if used in high-heat environments.
This component belongs to the 1N957B series of single Zener diodes produced by Central Semiconductor Corp. The series is characterized by its use in voltage regulation tasks across various sectors. The 'TR PBFREE' designation indicates tape-and-reel packaging without halogenated flame retardants, aligning with modern environmental standards for electronic components.
Consult official substitution guides for equivalent Zener diodes with matching voltage and power ratings. Verify pinout compatibility and package dimensions before integrating alternative parts into existing layouts.
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