1P00-2000-KR

Edgeboard Connectors Overview

The 3M 1P00-2000-KR is a Micro TCA AMC card connector designed for high-density electronic applications. It features a press-fit termination method and utilizes gold-plated copper alloy contacts with a specified thickness of 30.0µin (0.76µm). The component provides 85 positions per bay/row, ensuring reliable signal transmission in advanced modular computing architectures.

Edgeboard Connectors Feature Summary

• Utilizes press-fit termination for secure board mounting
• Features gold-plated copper alloy contacts for corrosion resistance
• Designed specifically for Micro TCA AMC card interfaces

Edgeboard Connectors Applications

• Micro TCA AMC card connections
• Advanced Modular Computing systems
• High-density electronic interconnects

Edgeboard Connectors Procurement Notes

Verify the specific contact position count and termination type against the official datasheet to ensure compatibility with the target PCB design. Confirm that the gold plating thickness meets the required durability standards for the intended operational environment. Ensure the part status remains active before finalizing procurement orders.

Edgeboard Connectors Selection Notes

Select this connector when a press-fit solution is required for Micro TCA AMC cards. Consider the 85-position density and gold contact specifications for signal integrity needs. Evaluate the mechanical stability provided by the press-fit method versus soldering requirements for the specific assembly process.

Edgeboard Connectors Part Context

This component belongs to the 3M Micro TCA connector family, engineered for Advanced Mezzanine Card applications. It supports high-reliability interconnects in telecommunications and industrial computing sectors, providing robust physical and electrical connections within compact form factors.

Edgeboard Connectors Replacement Considerations

Consult official 3M documentation for verified substitute part numbers. Cross-reference pin counts and termination styles to ensure functional equivalence without modifying the host board design.