1SG110HN3F43I3VG

Field Programmable Gate Array Overview

The Altera 1SG110HN3F43I3VG is a Stratix 10 GX Field Programmable Gate Array (FPGA) featuring 1,100,000 logic elements and 688 I/Os. It operates within a supply voltage range of 0.77V to 0.97V and supports a maximum data rate of 28.3 Gb/s across 48 transceivers. The device utilizes a 1760-BBGA/FCBGA package with dimensions of 42.5x42.5 mm. It is designed for operation in temperatures ranging from -40°C to +100°C (TJ).

Field Programmable Gate Array Feature Summary

• Contains 1,100,000 logic elements and 137,500 LAB/CLBs.
• Equipped with 48 high-speed transceivers supporting 28.3 Gb/s data rates.
• Operates on a core voltage between 0.77V and 0.97V.
• Housed in a 1760-pin FCBGA package suitable for surface mount installation.

Field Programmable Gate Array Applications

• High-performance networking infrastructure equipment.
• Data center acceleration and storage controllers.
• Industrial automation control systems.
• Test and measurement instrumentation.

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I3' indicates the industrial temperature grade (-40°C to +100°C TJ) as defined by Intel/Altera naming conventions. Confirm the package type matches the 1760-FBGA specification. Check for any Product Change Notifications (PCN) regarding label or marking updates that may affect part identification. Ensure compatibility with the required PCB footprint and thermal management solutions.

Field Programmable Gate Array Selection Notes

Select this model when 1.1 million logic elements and 688 I/Os are required. Ensure the design accommodates the 1760-BBGA package size of 42.5x42.5 mm. Verify power delivery networks support the 0.77V-0.97V core voltage range. Consider the 48 transceiver count for serial interface requirements. Compare against other Stratix 10 GX variants if different logic densities or I/O counts are needed.

Field Programmable Gate Array Part Context

This component belongs to the Intel Stratix 10 GX family, which targets high-performance computing and communications applications. It shares the same 1760-pin package form factor with other devices in the series, such as the 1SG085HN3F43I3XG and 1SG210HN3F43I3VG, allowing for potential pin-compatible design strategies across different logic capacities within the same package.

Field Programmable Gate Array Replacement Considerations

Direct substitutes within the same package include the 1SG085HN3F43I3XG (lower logic density) or the 1SG210HN3F43I3VG (higher logic density), provided the application does not require the specific 1.1M LE capacity. Verify that the alternative part number's suffix matches the required temperature grade and package variant.