1SG250LU3F50E3XG

Field Programmable Gate Array Overview

The Altera 1SG250LU3F50E3XG is a Field Programmable Gate Array (FPGA) belonging to the Stratix 10 GX 2500 series. It features 2,500,000 logic elements and 821,150 Adaptive Logic Modules (ALMs). The device includes 195 Mbit of embedded memory and supports up to 1,160 I/Os. It operates with a core voltage range of 770 mV to 970 mV and a typical operating voltage of 940 mV. The FPGA integrates 96 transceivers capable of data rates up to 28.3 Gb/s. It is housed in an FBGA-2397 package and is rated for commercial temperature operation between 0°C and +100°C.

Field Programmable Gate Array Feature Summary

• High-density fabric with 2,500,000 LEs and 821,150 ALMs
• Integrated 195 Mbit embedded memory capacity
• 96 high-speed transceivers supporting 28.3 Gb/s data rates
• FBGA-2397 surface-mount packaging

Field Programmable Gate Array Applications

• High-performance networking infrastructure
• Data center acceleration
• Industrial automation control systems

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'XG' against official Intel/Altera documentation to confirm it denotes the correct package variant and environmental rating. Confirm moisture sensitivity level (MSL) requirements and reflow soldering profiles prior to assembly. Ensure compatibility with the Stratix 10 GX family design tools and licensing models.

Field Programmable Gate Array Selection Notes

Select this component when designs require the specific combination of 2.5 million LEs and 96 transceivers within the Stratix 10 GX architecture. Compare against variants like 1SG250LU3F50E3VG if industrial temperature ratings (-40°C to +100°C) are required instead of the commercial grade specified here. Verify pinout compatibility with existing PCB layouts due to the FBGA-2397 form factor.

Field Programmable Gate Array Part Context

This part is part of the Stratix 10 GX family, designed for high-bandwidth applications. It shares the same logical fabric density as other 2500-series devices but differs in package type and thermal/environmental specifications defined by its suffix codes. It is manufactured using Intel's 20nm process technology.