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1SG280HU3F50E3XG is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA 704 I/O 2397BGA. Review the specifications below when checking this part for your BOM.
The Altera 1SG280HU3F50E3XG is a Stratix 10 GX Field Programmable Gate Array (FPGA) featuring 2,800,000 logic elements and 350,000 Adaptive Logic Modules. It supports up to 704 I/Os and includes 96 transceivers capable of data rates up to 28.3 Gb/s. The device integrates 229 Mbit of embedded memory and operates within a supply voltage range of 0.77V to 0.97V. It is housed in a 2397-BBGA FCBGA package with dimensions of 50x50 mm and supports an operating junction temperature range of -40°C to 100°C.
Verify the specific suffix E3 against official Intel/Altera documentation to confirm manufacturing lot details and revision level. Confirm moisture sensitivity level (MSL 3) requirements for storage and handling. Ensure compatibility with the 2397-FBGA footprint during PCB design review. Check for any pending Product Change Notices regarding labeling or material composition updates.
Select this model when requiring the Stratix 10 GX series capabilities with a 704 I/O count and extended temperature rating. Compare against the 1SG280HU3F50I3VG if a wider voltage range is acceptable but industrial temp is not required. Verify that the 2397 BGA package fits within the system's thermal and mechanical constraints. Ensure sufficient power delivery design for the 0.77V-0.97V core voltage domain.
This component belongs to the Intel Stratix 10 GX family, designed for high-performance computing and networking applications. It shares the same silicon die and logic architecture as other 1SG280 variants but differs in packaging, I/O configuration, and temperature grade. The 'GX' designation indicates the inclusion of high-speed transceivers optimized for serial communications.
Direct functional replacements include other 1SG280HU3F50 variants such as 1SG280HU3F50I3VG or 1SG280HU3F50E2VGAS, provided the temperature and voltage specifications align with the application requirements. Pin-to-pin compatibility exists within the same package type, but electrical characteristics must be verified.
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