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1SMB5946BT3G is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists onsemi. Its product description is DIODE ZENER 75V 3W SMB. Review the specifications below when checking this part for your BOM.
The 1SMB5946BT3G is a 3 W Zener voltage regulator diode from the 1SMB59xxBT3G series manufactured by onsemi. It features a nominal reverse Zener voltage of 75 V with a tolerance of ±5%, ranging from 71.25 V to 78.75 V. The device operates within a temperature range of −65°C to +150°C and utilizes an SMB (DO-214AA) surface-mount package. Key electrical parameters include a maximum dynamic impedance of 140 Ω at the test current of 5 mA, a maximum leakage current of 1 µA at 56 V, and a forward voltage of 1.5 V maximum at 200 mA.
Verify that the ordering suffix BT3G corresponds to the specific ±5% tolerance and tape-and-reel packaging configuration required for the application. Confirm compliance with RoHS directives and lead-free status as indicated by the G suffix. Ensure the SZ prefix is not required if automotive site control or unique part numbering is necessary, as the standard 1SMB59xxBT3G lacks AEC-Q101 qualification.
Select this component when a 75 V nominal regulation level is needed with moderate precision. The SMB package offers a balance between power dissipation capability and board space efficiency compared to axial leads. Consider the thermal derating characteristics above 75°C for steady-state operation and verify that the peak surge power ratings accommodate transient events in the target circuit environment.
This device belongs to the 1SMB59xxBT3G series of 3 W plastic surface mount Zener diodes. The series provides a wide selection of Zener voltages from 3.3 V to 200 V. The 1SMB5946BT3G specifically addresses applications requiring stable voltage reference or clamping at approximately 75 V, utilizing silicon junction technology housed in a void-free, transfer-molded plastic case.
Cross-reference with other manufacturers' SMB packaged 3 W Zener diodes rated at 75 V ±5%. Verify equivalent dynamic impedance, leakage current limits, and thermal resistance values to ensure functional compatibility without redesigning the PCB footprint.
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