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1ST165EU3F50I3XG is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA 440 I/O 2397BGA. Review the specifications below when checking this part for your BOM.
The Altera 1ST165EU3F50I3XG is a Stratix 10 TX Field Programmable Gate Array (FPGA) designed for high-performance logic applications. It features 1,650,000 Logic Elements and 569,200 Adaptive Logic Modules within the Stratix 10 TX 1650 series. The device integrates 120 Mbit of embedded memory and supports up to 704 I/Os. It operates with a core voltage range of 770 mV to 970 mV and includes 72 transceivers capable of data rates up to 57.8 Gb/s. The component functions within an industrial temperature range of -40°C to +100°C and is housed in a 2397-pin FBGA package.
Verify the specific suffix 'XG' against official Intel/Altera documentation, as standard listings often use 'VG'. Confirm moisture sensitivity level (MSL 3) and reflow soldering profiles during procurement. Check for current product change notices regarding labeling or packaging updates. Ensure supply chain sources provide valid RoHS compliance certificates. Validate lead times due to potential long manufacturing cycles associated with this FPGA family.
Select this model when requiring 1.65M LEs with extensive transceiver resources. Compare against 1ST085ES3F50I3VG if ARM Cortex A53 processing cores are needed instead of pure logic. Consider the 1ST210EU3F50I3VG for higher logic density. Ensure PCB design supports the 2397-pin FBGA footprint and thermal requirements for the 770-970 mV core voltage operation.
This part belongs to the Stratix 10 TX family, which focuses on high-speed serial connectivity and large-scale logic integration. It shares the same 2397-pin FBGA package form factor with other variants like 1ST165EU3F50I3VG. The 'TX' designation indicates optimized transceiver performance for demanding interface standards.
Direct functional substitutes include 1ST165EU3F50I3VG and 1ST165EU3F50I3LG, provided pin compatibility and electrical specifications match the design requirements. Verify that any replacement variant maintains the same package type and thermal characteristics.
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