1SX165HN1F43I2VG

Overview

The Altera 1SX165HN1F43I2VG is a Stratix 10 SX System on Chip FPGA featuring a quad-core ARM Cortex-A53 processor with CoreSight. It integrates 1,650,000 logic elements and 550,540 Adaptive Logic Modules within a 1760-ball FBGA package measuring 42.5x42.5 mm. The device includes 114 Mbit of embedded memory and supports up to 704 I/Os. It operates at a maximum frequency of 1.5 GHz with a core voltage range of 940 mV. The component functions within a junction temperature range of -40°C to 100°C and utilizes MSL 3 moisture sensitivity.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight for embedded control
• Provides high-density programmable logic with over 1.6 million logic elements
• Supports diverse connectivity interfaces including Ethernet, USB OTG, and SPI

Applications

• High-performance embedded processing systems requiring combined FPGA and CPU capabilities
• Industrial automation controllers utilizing integrated real-time processing
• Communication infrastructure equipment requiring flexible I/O configurations

Procurement Notes

Verify the specific suffix codes against official Intel/Altera documentation to confirm environmental ratings and packaging details. Ensure compatibility with required PCB footprint dimensions for the 1760-FBGA package. Confirm that the selected variant meets all necessary thermal and electrical specifications for the target application environment before finalizing orders.

Selection Notes

Select this model when a balance of moderate logic density and embedded processing power is required. Compare against the 1SX085 variant for lower resource needs or the 1SX280 variant for higher capacity. Verify that the 1760-ball package size fits the mechanical constraints of the design. Ensure the 1.5 GHz operating speed aligns with system timing requirements.

Part Context

This component belongs to the Stratix 10 SX family, designed for applications needing both soft-core processing and hardware acceleration. It shares the same 1760-FBGA package form factor as other devices in the series, such as the 1SX280HN3F43I3VG, facilitating potential board layout standardization across different performance tiers within the same product line.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material.