1SX250HU3F50I1VG

Overview

The Altera 1SX250HU3F50I1VG is a Stratix 10 SX System on Chip FPGA featuring 2,500,000 logic elements and 821,150 adaptive logic modules. It integrates 195 Mbit of embedded memory and supports 1,160 I/Os within a 2397-pin FBGA package. The device operates at a core voltage of 940 mV with a temperature range of -40°C to +100°C. It includes 96 high-speed transceivers capable of data rates up to 28.3 Gb/s, designed for complex SoC applications requiring significant programmable logic and processing integration.

Feature Summary

• Integrates an ARM Cortex-A53 processor subsystem with HPS for system-level control
• Provides extensive programmable fabric with high-density embedded memory blocks
• Supports high-speed serial communication via multiple transceiver channels
• Features advanced power management capabilities for thermal efficiency

Applications

• Telecommunications infrastructure equipment
• Industrial automation and control systems
• Data center acceleration and networking switches

Procurement Notes

Verify export compliance requirements as this component may require additional documentation for international shipping. Confirm moisture sensitivity level handling procedures upon receipt. Ensure ordering suffixes match specific performance grades and packaging options defined in the official datasheet to avoid functional mismatches.

Selection Notes

Select this model when high logic density and integrated hard processor systems are required. Compare against GX and TX series variants based on transceiver speed and I/O count needs. Verify that the 2397-pin package fits the target PCB layout constraints and thermal design specifications before finalizing the bill of materials.

Part Context

This part belongs to the Intel (formerly Altera) Stratix 10 SX family, which combines FPGA fabric with Hard Processor Systems. It targets applications needing both high-performance computing and flexible logic implementation. The SX variant specifically balances logic resources and memory capacity for cost-effective SoC designs compared to higher-end models.

Replacement Considerations

Direct pin-to-pin replacements within the same package and logic density are limited. Consider the 1SX250HU3F50I2VG or I3VG for different speed grades. For architectural upgrades, evaluate Agilex 5 devices, though pin compatibility requires redesign.