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The Altera 1SX280LN3F43E3VGS1 is a Stratix 10 SX System on Chip FPGA featuring an embedded quad-core ARM Cortex-A53 processor. It provides 2,800,000 logic elements and 229 Mbit of embedded memory within a 1760-ball FCBGA package measuring 42.5x42.5 mm. The device supports data rates up to 28.3 Gb/s via its transceivers and operates at a core voltage range of 0.82V to 0.88V. It includes integrated peripherals such as DMA and WDT, supporting interfaces including Ethernet, USB OTG, and SPI. The component functions reliably across a junction temperature range of 0°C to 100°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct package type and temperature rating. Confirm that the requested part number matches the exact density and feature set required for the design. Check for any recent Product Change Notifications regarding labeling or packaging updates before finalizing orders. Ensure compatibility with the intended PCB footprint and ball map specifications.
Select this model when both high-capacity FPGA fabric and embedded ARM processing are necessary within a single chip. Compare the 2.8 million logic element count against project requirements to avoid over-specification. Evaluate the power consumption characteristics relative to available cooling solutions. Consider the availability of development tools and IP cores compatible with the Stratix 10 architecture during the selection phase.
This component belongs to the Intel (formerly Altera) Stratix 10 SX family, designed for scalable performance in demanding applications. It sits alongside other variants like the 1SG280 series, differing primarily by the inclusion of the Hard Processor System. The Stratix 10 platform utilizes Intel's 14nm FinFET technology to deliver high efficiency and density compared to previous generations.
Direct replacements within the same family include other Stratix 10 SX devices with similar logic densities. Verify pin-to-pin compatibility if substituting with different package options in the 1760-ball form factor. Cross-family migration to Agilex devices requires architectural review due to differences in interconnect and processor integration.