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The TE Connectivity 2-2176747-0 is a single-channel, shielded multilayer ferrite chip bead designed for high-current power line applications. It features a 0603 (1608 metric) surface-mount package with dimensions of 1.6 mm length, 0.8 mm width, and 0.8 mm height. The component exhibits an impedance of 600 Ohms at a test frequency of 100 MHz and supports a maximum DC current of 1.2 A. Its maximum DC resistance is rated at 180 mOhms. The device operates within a temperature range of -55°C to +125°C and utilizes flexible soft terminals for reliable SMD/SMT mounting.
Verify the specific impedance tolerance and current rating requirements against the official datasheet before ordering. Confirm that the 0603 footprint and terminal type match the PCB design specifications. Ensure the operating temperature range meets the environmental conditions of the target application. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components.
Select this component when high current capacity is required alongside significant noise attenuation at 100 MHz. The low DC resistance helps minimize power loss in high-current paths. Consider the shielded design if magnetic coupling to nearby sensitive components is a concern. Evaluate the thermal performance under continuous load to ensure it stays within the specified temperature limits.
This ferrite bead belongs to the TE Connectivity Passive Product portfolio, specifically categorized under ferrite beads and chips. It is part of a series of multilayer ceramic components designed for surface-mount technology. The product line focuses on providing reliable EMI suppression solutions for modern electronic systems requiring compact form factors and robust electrical performance.
Consult the official TE Connectivity documentation for verified substitute part numbers. Ensure any replacement matches the 600 Ohm impedance at 100 MHz, 1.2 A current rating, and 0603 package dimensions. Verify that the alternative component offers comparable shielding and thermal stability for direct integration.