2-2176749-1

Overview

The TE Connectivity Passive Product component 2-2176749-1 is a shielded ferrite bead designed for surface mount applications in the 1206 package. It exhibits an impedance of 300 Ohms at 100 MHz and supports a maximum current rating of 2.5A. The device features a maximum DC resistance of 65mOhm and operates within a temperature range of -40°C to +125°C. It holds AEC-Q200 ratings, indicating suitability for automotive environments.

Feature Summary

• Provides electromagnetic interference suppression through high impedance characteristics at specific frequencies
• Shielded construction minimizes external magnetic field emissions
• Automotive-grade reliability certified under AEC-Q200 standards

Applications

• Automotive electronic circuits requiring EMI filtering
• Power supply lines needing noise attenuation
• Signal integrity protection in high-frequency data paths

Procurement Notes

Verify the exact impedance tolerance and DC resistance values against the official manufacturer datasheet before integration. Confirm that the AEC-Q200 qualification aligns with specific project requirements. Ensure the 1206 footprint dimensions match the PCB layout constraints precisely to avoid assembly issues.

Selection Notes

Select this component when a 1206 form factor is required for space-constrained designs. The 300 Ohm impedance at 100 MHz targets common noise frequencies in digital systems. The 2.5A current rating allows use in moderate power distribution networks without saturation concerns.

Part Context

This ferrite bead belongs to TE Connectivity's passive product portfolio focused on signal integrity solutions. It complements other components in the same series by offering standardized mounting footprints. The product line emphasizes reliability in harsh operating conditions typical of modern electronic assemblies.

Replacement Considerations

Check for direct substitutes within the same series having identical impedance curves. Verify that alternative parts maintain the same AEC-Q200 certification level. Ensure physical dimensions and terminal configurations remain compatible with existing board layouts.