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2-2371900-4 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is PCIE G5 CON,SMT,SLIM,164P,30",WO. Review the specifications below when checking this part for your BOM.
The TE Connectivity AMP Connectors part number 2-2371900-4 is a high-speed interconnect component designed for PCI Express™ applications. It features a female connector configuration with 164 positions, providing robust signal integrity for next-generation computing architectures. The connector utilizes a surface-mount technology (SMT) assembly method to facilitate automated manufacturing processes and ensure precise alignment on printed circuit boards. The contact interface is finished with gold plating to enhance conductivity and resist corrosion over time. The pitch between contacts is standardized at 0.039 inches (1.00mm), ensuring compatibility with industry-standard PCIe Gen 5 specifications. The housing is constructed from black polymer material, offering mechanical stability and visual identification within complex board layouts.
Verify the specific suffix and revision level against the manufacturer's latest datasheet to ensure compliance with current RoHS and REACH regulations. Confirm that the surface-mount footprint matches your design's CAD model, as minor packaging updates may occur. Check for any required auxiliary components such as retention clips or shrouds that are not included in the base housing assembly. Ensure storage conditions meet moisture sensitivity level requirements prior to reflow soldering.
Select this component when designing systems that require native support for PCI Express Gen 5 signaling rates. The 164-position count is optimal for x16 lane configurations with additional control lines. Consider the thermal management capabilities of the SMT package during layout planning. Verify that the host board can accommodate the 1.00mm pitch without excessive trace density issues. Evaluate the mechanical retention strength provided by the surface mount pads versus alternative through-hole options if vibration resistance is critical.
This component belongs to the broader family of high-speed interconnect solutions offered by TE Connectivity under the AMP Connectors brand. It is specifically engineered to address the increasing bandwidth demands of modern computing environments. The product represents an evolution in connector technology, moving towards higher pin counts and finer pitches while maintaining signal integrity. It serves as a critical link between processors and peripheral devices in advanced electronic systems.
Public confirmed substitute part numbers are not available in the provided documentation. Direct replacement requires verification of electrical parameters, mechanical dimensions, and mounting compatibility with the original design specifications.
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