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The Digi 20-101-0856 is a RabbitCore embedded module featuring the CM7120 processor core. It integrates 512KB of SRAM for data storage and operates within an industrial temperature range of -40°C to 85°C. The module utilizes two IDC headers with a 2x17 pin configuration for connectivity. Its physical dimensions are 1.160 inches in length by 1.380 inches in width, equivalent to 29.50mm x 34.90mm. This component is classified as a Single Board Computer (SBC) MPU Core designed for embedded applications.
Verify the specific revision level and manufacturing date code against current Digi International documentation before procurement. Confirm that the 2x17 IDC connector orientation matches the target host board layout. Ensure environmental compliance requirements align with RoHS standards. Cross-reference the part number with official obsolescence notices to confirm availability status for long-term production planning.
Select this module when a RabbitCore architecture is required with integrated SRAM rather than external memory interfaces. The fixed 512KB capacity suits applications with moderate memory constraints. Consider the physical footprint and IDC interface compatibility during mechanical design. Evaluate thermal management needs given the specified operating temperature range for the intended enclosure environment.
This component belongs to the RabbitCore series of embedded modules manufactured by Digi International. It serves as a complete computing solution combining the processor and memory on a single board. The series is designed for developers utilizing Rabbit Semiconductor technology for embedded networking and control tasks. It represents a specialized hardware platform distinct from general-purpose microcontrollers.
Public confirmed substitute part numbers are not available in the provided documentation. Consult Digi International directly for current product line replacements or end-of-life alternatives. Verify functional equivalence regarding the RabbitCore architecture and memory specifications if considering third-party options.