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The Oupiin 2011-1X18G00SB is a single-row male pin header from the 2011 series, designed for surface mount technology (SMT) assembly. It features a 2.54mm (0.100 inch) pitch and accommodates 18 positions. The connector utilizes a plugin package configuration with black insulation and square contact shapes. It supports a current rating of 3A per contact and operates within a temperature range of -40°C to +105°C. The component complies with RoHS standards.
Verify that the specific suffix G00SB corresponds to the required gold plating thickness and contact material specifications for your application environment. Confirm the exact physical height and standoff dimensions against your PCB silkscreen and mechanical constraints. Ensure the SMT pad layout matches the manufacturer's recommended footprint to guarantee reliable solder joint formation during automated assembly processes.
Select this component when a single-row, 18-position male header is required for low-current signal transmission up to 3A. The 2.54mm pitch makes it suitable for standard digital logic interfaces. Consider the operating temperature range of -40°C to +105°C for environments with moderate thermal stress. Evaluate the SMT assembly requirement against your manufacturing capabilities compared to through-hole alternatives.
This part belongs to the Oupiin 2011 series, which offers various position counts ranging from short to long configurations. The series provides consistent electrical characteristics across different lengths while allowing flexibility in the number of contacts. The 1X18 designation indicates a single row with eighteen pins, maintaining uniform pitch and mechanical properties found throughout the product line.
Direct substitutes must match the 2.54mm pitch, 18-position count, single-row male pin configuration, and SMT mounting style. Verify that alternative components support the same 3A current rating and -40°C to +105°C temperature range. Ensure physical dimensions, including height and pin length, are compatible with the existing PCB design and enclosure constraints.