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2066530056 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Molex. Its product description is CONN EDGE DUAL FMALE 56POS 0.024. Review the specifications below when checking this part for your BOM.
The Molex 2066530056 is a vertical sliver edge card connector designed for high-speed data transmission. It features a 0.60mm (0.024 inch) pitch and supports up to 32 Gbps per lane. The component has 56 circuits arranged in a dual-sided configuration with 28 contacts per side. It utilizes gold-plated copper alloy terminals and a black liquid crystal polymer (LCP) insulator reinforced with glass fiber. The connector accommodates a PCB thickness of 1.57mm (0.062 inch) and operates within a temperature range of -55°C to +85°C.
Verify the specific ordering suffix against the official Molex datasheet to confirm terminal plating thickness and material specifications. Ensure that the selected variant matches the required PCB thickness tolerance of 1.57mm. Cross-reference the RoHS compliance status with the latest product specification document before finalizing procurement orders.
Select this connector when a vertical, dual-sided edge interface is required for high-frequency applications. The 0.60mm pitch allows for compact layout designs. Ensure the mating card meets the specified mechanical tolerances for sliver edge connectors. Confirm that the operating environment remains within the -55°C to +85°C range to maintain performance reliability.
This component belongs to the Molex 206653 series, which focuses on sliver edge card connectors. The series is engineered for demanding environments requiring robust electrical connections. The 2066530056 variant specifically addresses the need for 56-circuit capacity in a low-profile vertical form factor, suitable for modern electronic assemblies.
No public confirmed substitute part numbers are available in the provided documentation. Direct replacement requires matching the 0.60mm pitch, 56-position dual-side configuration, and vertical mounting style. Verify mechanical footprint compatibility with the existing PCB design.
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