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2170231-2 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN EDGE DUAL FMALE GOLD. Review the specifications below when checking this part for your BOM.
The TE Connectivity AMP Connectors part number 2170231-2 is a hybrid card edge power connector designed for board-to-board applications. It features dual female contacts with gold plating and utilizes through-hole mounting in a right-angle orientation. The termination method employs press-fit technology to provide secure, solder-free connections. This component integrates both power and signal capabilities within a single housing structure.
Verify RoHS compliance status as sources indicate conflicting information regarding this specific attribute. Confirm the active lifecycle status and current manufacturing lead times directly with authorized distributors or the manufacturer before placing orders. Ensure compatibility with existing PCB layouts and mating connectors.
Select this component when a hybrid solution for simultaneous power and signal transfer is required. The right-angle orientation and press-fit termination are suitable for applications needing robust mechanical stability without soldering. Verify that the board thickness and hole specifications align with the press-fit requirements.
This connector belongs to the TE Connectivity AMP Connectors portfolio of hybrid card edge solutions. These components are engineered to simplify assembly processes by integrating multiple connection types into a single interface point, reducing overall system complexity and footprint.
No public confirmed substitute part numbers are available in the provided documentation. Consult TE Connectivity technical support for potential cross-references if this specific model is unavailable.
The connector uses press-fit termination technology for secure, solder-free connections.
Yes, it is designed as a hybrid card edge connector for board-to-board applications, supporting both power and signal in a compact form factor.
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