2170823021

Edgeboard Connectors Overview

The Molex 217082-3021 is a Mini Cool Edge (MCIO) vertical card edge connector designed for PCI Express Gen 5 applications. It features a dual-side contact configuration with 124 circuits arranged in two rows. The connector utilizes a 1.50mm solder peg length and supports a maximum card thickness of 1.57mm. Contact plating consists of 0.75µm gold over nickel, ensuring reliable high-speed signal transmission at data rates up to 32.0 Gbps per lane. The housing is constructed from black high-temperature thermoplastic, while the shell is nickel-plated. It operates within a temperature range of -40°C to +85°C and supports a maximum current of 1.1A per contact.

Edgeboard Connectors Feature Summary

• Supports PCI Express Gen 5 high-speed data transmission standards
• Vertical orientation with dual-side card edge contacts for robust board connection
• Gold-plated contacts ensure low insertion resistance and corrosion resistance
• Integrated pick-and-place cap compatibility for automated assembly processes

Edgeboard Connectors Applications

• High-performance computing server backplanes
• PCI Express Gen 5 expansion cards and add-in boards
• Data center interconnect modules requiring high bandwidth
• Industrial control systems utilizing PCIe Gen 5 interfaces

Edgeboard Connectors Procurement Notes

Verify the specific ordering suffix to confirm the exact solder peg length and contact plating thickness required for your design. Ensure the mating card thickness aligns with the 1.57mm specification. Confirm compliance requirements such as EU RoHS and REACH status if applicable to your region. Check for availability of the pick-and-place cap accessory if automated assembly is planned. Validate that the 124-circuit count matches the target PCB layout dimensions.

Edgeboard Connectors Selection Notes

Select this component when designing for PCI Express Gen 5 performance levels requiring 32.0 Gbps per lane capabilities. The vertical form factor is suitable for space-constrained applications where height is limited but board-to-board or card-edge connectivity is needed. Consider the 1.50mm peg length for standard PCB thicknesses. Evaluate the thermal management needs given the operating temperature range and material properties. Ensure the mating connector system supports the specified locking mechanism and durability cycles.

Edgeboard Connectors Part Context

This part belongs to the Molex 217082 series of Mini Cool Edge connectors, which are engineered for next-generation high-speed I/O applications. The series provides solutions for demanding environments requiring reliable signal integrity at elevated data rates. The 217082-3021 variant specifically targets dual-sided card edge implementations with a high circuit count. It represents an evolution in MCIO technology, balancing density with mechanical stability for modern electronic systems.

Edgeboard Connectors Replacement Considerations

Direct substitutes within the same series may include variants with different peg lengths or contact counts, such as the 217082-2023, though pin counts and physical dimensions differ. Verify mechanical fit and electrical specifications before substitution. Cross-model replacements require careful evaluation of mating interface compatibility and signal integrity requirements.