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The TE Connectivity Passive Product component 2176743-7 is a shielded ferrite bead designed for surface mount applications. It utilizes the 0603 (1608 Metric) package with dimensions of 1.6 mm length and 0.8 mm width. The device exhibits an impedance of 150 Ohms at a test frequency of 100 MHz. It supports a maximum DC current rating of 1 Ampere and maintains a low DC resistance of 200 milliohms. The unit operates reliably within a temperature range spanning from -40°C to +125°C.
Verify the specific impedance tolerance and current rating requirements against the official datasheet before integration. Confirm that the 0603 package dimensions align with your PCB land pattern design. Ensure the selected variant meets the required thermal management standards for your intended operating environment. Cross-reference the manufacturer part number to avoid confusion with similar unshielded or differently rated components in the Sigma Inductors portfolio.
Select this component when space constraints necessitate a small form factor without compromising shielding effectiveness. The 1A current rating makes it suitable for moderate power lines where noise reduction is critical. Consider the 150 Ohm impedance value relative to the target noise frequency spectrum. Evaluate the 200 milliohm DC resistance impact on overall circuit efficiency. Ensure compatibility with standard reflow soldering profiles for the 0603 package type.
This ferrite bead belongs to the TE Connectivity Passive Product lineup, specifically under the Sigma Inductors category. It serves as a passive component for electromagnetic interference suppression in modern electronic systems. The 0603 package represents a standard industry size for surface mount technology, balancing performance with board real estate efficiency. It complements other signal conditioning components in complex multi-layer PCB designs.
Direct substitutes must match the 0603 package, 150 Ohm impedance at 100 MHz, and 1A current rating. Verify shielding configuration equivalence to maintain EMI performance. Check for identical thermal and electrical specifications to ensure seamless integration without circuit redesign.