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The TE Connectivity 2176744-3 is a single-channel, automotive-grade multilayer ferrite chip bead designed for surface-mount applications. It features an 0805 (2012 metric) package with dimensions of 2.0 mm length, 1.25 mm width, and 1.0 mm height. The component provides an impedance of 7 Ohms at a test frequency of 100 MHz and supports a maximum DC current rating of 3 A. Its maximum DC resistance is specified at 30 mOhms. The device operates within a temperature range of -55°C to +125°C and is shielded.
Verify the specific ordering suffix and packaging configuration directly with TE Connectivity or authorized distributors before purchase. Confirm that the component meets the required automotive qualification standards for your specific application environment. Ensure compatibility with your assembly process regarding the 0805 footprint and soldering profile. Check for any recent lifecycle status updates or alternative part recommendations from the manufacturer.
Select this component when a low-impedance path is required for high-current automotive power lines while maintaining effective high-frequency noise attenuation. The 0805 package offers a compact solution for space-constrained designs. Consider the 3 A current rating and 30 mOhm DCR to ensure minimal voltage drop and power loss in the circuit. Verify thermal performance under maximum load conditions within the specified operating temperature range.
This ferrite bead belongs to TE Connectivity's Sigma Inductors passive product portfolio, specifically engineered for automotive applications. It is part of a broader family of multilayer chip beads designed to meet stringent automotive reliability standards. The product complements other EMI suppression solutions offered by TE Connectivity for comprehensive noise management in complex vehicle electrical architectures.
Direct substitutes include TE Connectivity part numbers 2176747-3 and 2-2176744-3, which share similar ferrite bead characteristics but may differ in package size or impedance values. Verify functional equivalence and physical footprint compatibility before substitution.