2176747-8

Overview

The TE Connectivity Passive Product 2176747-8 is a single-line power line ferrite bead designed for surface mount applications. It features a 0603 (1608 Metric) package and provides an impedance of 30 Ohms at 100 MHz. The component supports a maximum DC current of 4A with a low DC resistance of 30mOhm, making it suitable for high-current filtering requirements in compact electronic designs.

Feature Summary

• Provides effective electromagnetic interference suppression for power lines
• Designed for high-current handling capabilities in compact form factors
• Utilizes multilayer ceramic technology for robust surface mount integration

Applications

• Power line filtering in portable electronics
• Noise suppression in automotive electronic control units
• Signal integrity management in industrial equipment power supplies

Procurement Notes

Verify the specific impedance tolerance and DC resistance values against the official TE Connectivity datasheet before procurement. Confirm that the 0603 package dimensions align with your PCB footprint requirements. Ensure the selected variant meets the required operating temperature range for your specific application environment to guarantee long-term reliability.

Selection Notes

Select this component when a 30 Ohm impedance at 100 MHz is required for power line noise attenuation. Consider the 4A current rating to ensure adequate headroom for your circuit's peak loads. The 0603 size offers a balance between performance and board space efficiency compared to larger packages.

Part Context

This ferrite bead belongs to the Sigma BMC-Q series, which focuses on automotive-grade reliability and high-current performance. The series utilizes advanced multilayer ferrite technology to provide stable impedance characteristics across varying temperatures and frequencies, supporting stringent industry standards for electronic components.

Replacement Considerations

Cross-reference part number 1-2176747-8 for potential alternatives within the same product family. Verify that any substitute maintains identical impedance, current rating, and package dimensions to ensure compatibility without redesigning the printed circuit board layout.