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The TE Connectivity 2176748-5 is a single-channel ferrite chip bead designed for power line applications. It features an 0805 (2012 metric) surface-mount package with dimensions of 2.0 mm length, 1.25 mm width, and 1.0 mm height. The component provides an impedance of 11 Ohms at a test frequency of 100 MHz. It supports a maximum DC current of 3 A and has a maximum DC resistance of 50 mOhms. The device operates within a temperature range of -55°C to +125°C.
Verify the specific impedance tolerance and current rating requirements against the official datasheet before procurement. Confirm that the 0805 package dimensions align with the printed circuit board layout constraints. Ensure compatibility with the intended operating temperature range of -55°C to +125°C. Check for any specific handling or storage conditions required for ferrite components. Validate that the manufacturer's standard lead time meets project schedules.
Select this component when a low-impedance path is required for DC power while attenuating high-frequency noise. The 11 Ohm impedance at 100 MHz makes it suitable for general-purpose EMI suppression rather than precise filtering. Consider the 3 A current rating to ensure adequate headroom for the application's peak load. The 0805 package offers a balance between size and thermal performance compared to smaller footprints.
This part belongs to the TE Connectivity Sigma Inductors passive product family. It is categorized under ferrite beads and chip filters. The component is manufactured by TE Connectivity Passive Product. It serves as a passive electronic component used for noise reduction in electrical circuits. The product line focuses on reliable performance in various industrial and commercial environments.
Direct substitutes must match the 11 Ohm impedance at 100 MHz, 0805 package size, and 3 A current rating. Verify that alternative parts maintain similar DC resistance and temperature coefficients. Cross-reference with other TE Connectivity BMC-Q series variants if available. Ensure mechanical footprint compatibility with existing PCB designs.