2214913-5

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 2214913-5 is a MULTI-BEAM card edge connector designed for dual-edge applications. It features a vertical through-hole mount configuration with a total of 16 contacts, arranged as eight power and eight signal positions. The connector utilizes a 1.4 mm centerline spacing to support high-density requirements in server market environments.

Edgeboard Connectors Feature Summary

• Delivers combined power and signal density for next-generation server architectures
• Engineered for reliable electrical connections in dual-edge configurations

Edgeboard Connectors Applications

• Server board interconnects
• High-performance computing systems
• Dual-edge card applications requiring mixed signal and power routing

Edgeboard Connectors Procurement Notes

Verify the specific contact plating and mating cycle ratings against the official datasheet before integration. Confirm that the 1.4 mm pitch aligns with the target PCB layout and that the vertical orientation matches the mechanical assembly constraints. Ensure compatibility with mating card edge thickness specifications provided by the manufacturer.

Edgeboard Connectors Selection Notes

Select this component when high current carrying capacity alongside signal integrity is required in a compact form factor. The dual-side design accommodates both power distribution and data transmission on a single interface. Evaluate thermal management needs as the connector supports significant power loads within the server infrastructure context.

Edgeboard Connectors Part Context

This component belongs to the MULTI-BEAM series, which represents TE Connectivity's advanced interconnect solutions. The series targets demanding applications where space efficiency and performance are critical. It serves as a specialized solution within the broader portfolio of card edge connectors offered by the manufacturer.

Edgeboard Connectors Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Verify cross-compatibility with existing system designs if considering alternative sources.