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22286100 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Molex. Its product description is CONN HEADER R/A 10POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Molex 22-28-6100 is a single-row crimp housing for KK 2.54mm PCB headers, featuring a right-angle orientation and ten circuits. Constructed with natural polyester resin and brass contacts tin-plated for conductivity, it supports through-hole termination on printed circuit boards. The component operates within a temperature range of -40°C to +105°C and meets UL 94V-0 flammability standards. Designed for reliable signal transmission in compact electronic assemblies, this housing ensures secure mating with corresponding header pins.
Verify the specific ordering suffix against official Molex documentation to confirm pin count, plating material, and packaging format. Ensure compatibility with mating KK 2.54mm series headers. Confirm that the selected variant meets the required environmental ratings for the intended application environment before finalizing procurement orders.
Select this housing when a right-angle, single-row interconnect solution is required for low-to-medium density applications. It is suitable for designs prioritizing compact footprint over high-power transmission. Evaluate thermal requirements against the specified operating range and ensure mating connector alignment matches the housing orientation.
This component belongs to the Molex KK 2.54mm series, a widely utilized family of connectors known for their versatility in general-purpose electronic applications. The series offers various configurations including straight and right-angle options, catering to diverse PCB layout needs across commercial and industrial sectors.
Direct substitutes must match the 2.54mm pitch, single-row architecture, and right-angle form factor. Verify that alternative housings maintain identical terminal dimensions and locking mechanisms to ensure mechanical interchangeability without redesigning the PCB footprint.
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