2309-1HDCG

Overview

The Renesas 2309-1HDCG is a zero-delay clock buffer IC housed in a 16-SOIC package. It operates on a single 3V to 3.6V supply and supports frequencies up to 133MHz. The device features one LVCMOS input and nine LVCMOS outputs with a 1:9 distribution ratio. Key electrical parameters include a maximum propagation delay of 0ps, output skew under 250ps, and cycle-to-cycle jitter below 200ps. It functions within a commercial temperature range of 0°C to +70°C.

Feature Summary

• Zero-delay PLL architecture aligns output phase with the reference input
• Distributes one input signal to nine low-skew outputs
• Operates at frequencies from 10MHz to 133MHz
• Includes separate output enable controls for two output banks

Applications

• High-speed clock distribution networks
• System synchronization in digital logic circuits
• Low-jitter clock generation for data converters

Procurement Notes

Verify the specific suffix 'HDCG' against the manufacturer's current datasheet to confirm pinout compatibility and drive strength specifications. Ensure the procurement source provides RoHS compliance documentation consistent with the component's lead-free status. Confirm moisture sensitivity level (MSL 3) handling requirements during storage and assembly.

Selection Notes

Select this component when a single-ended LVCMOS clock source requires expansion into multiple synchronized outputs with minimal skew. The -1H designation indicates high drive capability suitable for heavier capacitive loads compared to standard variants. Verify that the required operating frequency falls within the 10MHz to 133MHz range for optimal jitter performance.

Part Context

This part belongs to the IDT/Renesas 2309 series of zero-delay buffers. It serves as a successor or variant to earlier models like the 2305A, offering increased fan-out capabilities. The device utilizes proprietary low-jitter PLL techniques to maintain signal integrity across high-speed digital systems.

Replacement Considerations

Microchip PL123-09SC-R is documented as a similar replacement option. Verify functional equivalence regarding voltage levels and package dimensions before substitution.