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2327670-2 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN EDGE DUAL FML 140POS 0.024. Review the specifications below when checking this part for your BOM.
The TE Connectivity AMP Connectors part number 2327670-2 is a dual-edge card edge connector belonging to the Sliver 2.0 series. It features 140 positions arranged in two rows with a pitch of 0.024 inches (0.60mm). The connector utilizes gold-plated copper alloy contacts and an LCP insulator, rated for operation between -55°C and +85°C. Designed for surface mount installation at a right angle, it supports solder termination and accommodates board thicknesses up to 0.062 inches (1.57mm).
Verify component authenticity through authorized TE Connectivity channels or certified distributors. Confirm RoHS3 compliance status prior to integration. Ensure storage conditions maintain integrity of the gold plating and LCP housing. Cross-reference datasheet revisions to confirm current manufacturing specifications before finalizing procurement orders.
Select this component when high-density dual-edge connectivity is required for surface-mounted assemblies. The 0.60mm pitch allows for compact designs while maintaining robust mechanical stability. Consider the right-angle form factor for space-constrained environments where vertical clearance is limited but horizontal board real estate is available.
This connector belongs to the Sliver 2.0 family, engineered for demanding electronic environments. The series emphasizes reliability and precision in high-frequency applications. As a specialized edge board solution, it supports complex system architectures requiring secure and consistent electrical connections across multiple signal lines.
Consult official TE Connectivity documentation for verified substitute part numbers within the Sliver 2.0 series. Ensure any replacement matches the 140-position count, 0.60mm pitch, and dual-row configuration. Verify compatibility with existing PCB footprints and mounting requirements before substitution.
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