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2327677-1 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN EDGE DUAL FML 140POS 0.024. Review the specifications below when checking this part for your BOM.
The TE Connectivity AMP Connectors 2327677-1 is a standard card edge receptacle assembly featuring 140 positions arranged in a dual-row configuration. It utilizes a 0.6 mm pitch and is designed for vertical, straight mounting via pegs. The contacts are gold-plated copper alloy, rated for 1.1 A current, while the liquid crystal polymer housing supports operation between -55°C and +85°C.
Verify the specific ordering suffix to confirm pin count, contact plating thickness, and packaging format. Ensure compatibility with the target PCB footprint and mating card edge thickness. Confirm RoHS compliance status and moisture sensitivity level requirements before finalizing procurement orders.
Select this component for applications requiring high-density vertical interconnects with a 0.6 mm pitch. Evaluate the 1.1 A current rating against circuit demands and verify that the operating temperature range of -55°C to +85°C meets environmental specifications. Ensure the mounting style aligns with the assembly process.
This part belongs to the Sliver 2.0 series, optimized for SFF-TA-1002 internal I/O applications. It serves as a high-density solution for connecting daughterboards to main systems within compact form factors, offering robust mechanical retention through its integrated mounting peg structure.
Consult official TE Connectivity documentation for direct cross-reference part numbers. Verify identical electrical ratings, mechanical dimensions, and contact configurations before substituting.
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