Edgeboard Connectors 2327677-1 product image

2327677-1

$6.75
  • Description:CONN EDGE DUAL FML 140POS 0.024
  • Series:Sliver 2.0
  • Mfr:TE Connectivity AMP Connectors
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:1d9cc794112e Category: Brand:

  
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2327677-1 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN EDGE DUAL FML 140POS 0.024. Review the specifications below when checking this part for your BOM.

Edgeboard Connectors specifications for 2327677-1

  • Description:CONN EDGE DUAL FML 140POS 0.024
  • Series:Sliver 2.0
  • Mfr:TE Connectivity AMP Connectors
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Card Type:Non Specified - Dual Edge
  • Gender:Female
  • Number of Positions/Bay/Row:28; 14; 28
  • Number of Positions:140
  • Card Thickness:0.062" (1.57mm)
  • Number of Rows:2
  • Pitch:0.024" (0.60mm)
  • Read Out:Dual
  • Features:Board Guide, Pick and Place, Solder Retention
  • Mounting Type:Surface Mount
  • Termination:Solder
  • Contact Material:Copper Alloy
  • Contact Finish:Gold
  • Contact Finish Thickness:Flash
  • Contact Type:-
  • Color:Black
  • Flange Feature:-
  • Operating Temperature:-55°C ~ 85°C

Edgeboard Connectors datasheet and documents for 2327677-1

2327677-1

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors 2327677-1 is a standard card edge receptacle assembly featuring 140 positions arranged in a dual-row configuration. It utilizes a 0.6 mm pitch and is designed for vertical, straight mounting via pegs. The contacts are gold-plated copper alloy, rated for 1.1 A current, while the liquid crystal polymer housing supports operation between -55°C and +85°C.

Edgeboard Connectors Feature Summary

  • Vertical surface-mount design with mounting pegs for secure board alignment
  • Gold-plated copper alloy contacts ensure reliable signal transmission
  • Liquid crystal polymer housing provides thermal stability and structural integrity

Edgeboard Connectors Applications

  • SFF-TA-1002 internal I/O connections
  • Daughtercard board-to-board interconnects
  • High-density electronic system backplanes

Edgeboard Connectors Procurement Notes

Verify the specific ordering suffix to confirm pin count, contact plating thickness, and packaging format. Ensure compatibility with the target PCB footprint and mating card edge thickness. Confirm RoHS compliance status and moisture sensitivity level requirements before finalizing procurement orders.

Edgeboard Connectors Selection Notes

Select this component for applications requiring high-density vertical interconnects with a 0.6 mm pitch. Evaluate the 1.1 A current rating against circuit demands and verify that the operating temperature range of -55°C to +85°C meets environmental specifications. Ensure the mounting style aligns with the assembly process.

Edgeboard Connectors Part Context

This part belongs to the Sliver 2.0 series, optimized for SFF-TA-1002 internal I/O applications. It serves as a high-density solution for connecting daughterboards to main systems within compact form factors, offering robust mechanical retention through its integrated mounting peg structure.

Edgeboard Connectors Replacement Considerations

Consult official TE Connectivity documentation for direct cross-reference part numbers. Verify identical electrical ratings, mechanical dimensions, and contact configurations before substituting.

2327677-12327677-1
$6.75
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