2327678-7

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 2327678-7 is a vertical card edge receptacle assembly belonging to the Sliver 2.0 series. It features 84 positions arranged in two rows with a 0.024-inch (0.60mm) pitch. The connector utilizes gold-plated copper alloy contacts and a black liquid crystal polymer (LCP) insulator. Designed for surface mount installation, it supports dual-edge card types and operates within a temperature range of -55°C to 105°C.

Edgeboard Connectors Feature Summary

• High-density interconnect design optimized for low temperature rise and power loss
• Vertical orientation facilitates efficient board space utilization
• Gold-plated contacts ensure reliable signal transmission
• Liquid crystal polymer insulation provides thermal stability

Edgeboard Connectors Applications

• High-speed internal interconnects compliant with SFF-TA-1002 standard
• Server backplane connections
• Storage area network equipment
• Telecommunications infrastructure hardware

Edgeboard Connectors Procurement Notes

Verify the specific ordering suffix to confirm packaging configuration, as variants exist for tape and reel or cut tape formats. Ensure the selected component matches the required pin count and row configuration for your circuit design. Cross-reference the manufacturer datasheet to confirm current availability status and any recent product change notices that may affect lead times or material specifications before finalizing procurement orders.

Edgeboard Connectors Selection Notes

Select this component when a high-pin-count, narrow-pitch vertical interface is required for dense electronic assemblies. The 0.60mm spacing allows for significant I/O density within constrained footprints. Consider the LCP material properties for applications requiring robust thermal performance during soldering processes. Confirm compatibility with the mating card edge thickness and guide rail requirements specified in the mechanical drawings.

Edgeboard Connectors Part Context

This receptacle belongs to the Sliver 2.0 family, engineered for compact form factors in data center and enterprise storage environments. The series emphasizes signal integrity and thermal management for high-performance computing applications. It serves as a critical link between system boards and peripheral modules, ensuring stable electrical connections in demanding operational conditions.

Edgeboard Connectors Replacement Considerations

Direct substitutes include other TE Connectivity Sliver 2.0 series receptacles with matching 84-position configurations and 0.60mm pitch. Verify mechanical dimensions and contact plating specifications to ensure interchangeability without redesigning the printed circuit board layout.