Edgeboard Connectors 2327679-1 product image

2327679-1

$5.11
  • Description:CONN EDGE DUAL FMALE 56POS 0.024
  • Series:Sliver 2.0
  • Mfr:TE Connectivity AMP Connectors
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:bd3aa306fe28 Category: Brand:

  
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2327679-1 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN EDGE DUAL FMALE 56POS 0.024. Review the specifications below when checking this part for your BOM.

Edgeboard Connectors specifications for 2327679-1

  • Description:CONN EDGE DUAL FMALE 56POS 0.024
  • Series:Sliver 2.0
  • Mfr:TE Connectivity AMP Connectors
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Card Type:Non Specified - Dual Edge
  • Gender:Female
  • Number of Positions/Bay/Row:28
  • Number of Positions:56
  • Card Thickness:0.062" (1.57mm)
  • Number of Rows:2
  • Pitch:0.024" (0.60mm)
  • Read Out:Dual
  • Features:Board Guide, Pick and Place, Solder Retention
  • Mounting Type:Surface Mount
  • Termination:Solder
  • Contact Material:Copper Alloy
  • Contact Finish:Gold
  • Contact Finish Thickness:Flash
  • Contact Type:-
  • Color:Black
  • Flange Feature:-
  • Operating Temperature:-55°C ~ 85°C

Edgeboard Connectors datasheet and documents for 2327679-1

2327679-1

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 2327679-1 is a vertical receptacle assembly belonging to the Sliver series, designed for SFF-TA-1002 internal I/O applications. It features 56 positions with a dual-edge configuration and a 0.60mm (0.024 inch) contact pitch. The connector utilizes gold-plated copper alloy contacts housed in black liquid crystal polymer (LCP). It supports a card thickness of 1.57mm (0.062 inch) and operates within a temperature range of -55°C to +85°C.

Edgeboard Connectors Feature Summary

  • Vertical PCB mount design optimized for high-density internal I/O connections
  • Dual-edge female contact configuration for secure board engagement
  • Gold-plated copper alloy contacts ensure reliable signal transmission
  • Liquid crystal polymer housing provides thermal stability

Edgeboard Connectors Applications

  • SFF-TA-1002 compliant internal interconnects
  • EDSFF storage device interfaces
  • High-density server backplane connections

Edgeboard Connectors Procurement Notes

Verify the specific suffix and revision level against the manufacturer's latest datasheet to ensure compatibility with current design requirements. Confirm that the intended application environment falls within the specified operating temperature range and mechanical constraints defined for the Sliver series components.

Edgeboard Connectors Selection Notes

Select this component when a vertical, dual-edge receptacle with a 0.60mm pitch is required for SFF-TA-1002 implementations. Ensure the mating card thickness matches the 1.57mm specification. Consider the LCP material properties for thermal management needs in high-density electronic assemblies.

Edgeboard Connectors Part Context

This component is part of the Sliver family, which addresses the demand for high-speed, high-density connectivity in modern data center and enterprise storage architectures. It serves as a critical interface solution for next-generation form factors requiring robust electrical performance in compact spaces.

Edgeboard Connectors Replacement Considerations

Consult official TE Connectivity documentation for verified substitute part numbers. Generic equivalents may not meet the precise dimensional or electrical specifications required for SFF-TA-1002 compliance.

2327679-12327679-1
$5.11
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