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2327679-1 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN EDGE DUAL FMALE 56POS 0.024. Review the specifications below when checking this part for your BOM.
The TE Connectivity AMP Connectors part number 2327679-1 is a vertical receptacle assembly belonging to the Sliver series, designed for SFF-TA-1002 internal I/O applications. It features 56 positions with a dual-edge configuration and a 0.60mm (0.024 inch) contact pitch. The connector utilizes gold-plated copper alloy contacts housed in black liquid crystal polymer (LCP). It supports a card thickness of 1.57mm (0.062 inch) and operates within a temperature range of -55°C to +85°C.
Verify the specific suffix and revision level against the manufacturer's latest datasheet to ensure compatibility with current design requirements. Confirm that the intended application environment falls within the specified operating temperature range and mechanical constraints defined for the Sliver series components.
Select this component when a vertical, dual-edge receptacle with a 0.60mm pitch is required for SFF-TA-1002 implementations. Ensure the mating card thickness matches the 1.57mm specification. Consider the LCP material properties for thermal management needs in high-density electronic assemblies.
This component is part of the Sliver family, which addresses the demand for high-speed, high-density connectivity in modern data center and enterprise storage architectures. It serves as a critical interface solution for next-generation form factors requiring robust electrical performance in compact spaces.
Consult official TE Connectivity documentation for verified substitute part numbers. Generic equivalents may not meet the precise dimensional or electrical specifications required for SFF-TA-1002 compliance.
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