2327679-5

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 2327679-5 is a vertical edgeboard receptacle assembly designed for dual-edge card applications. It features 56 positions with a 0.60mm (0.024 inch) contact pitch. The connector utilizes gold-plated contacts and is housed in black insulating material, suitable for surface-mount termination.

Edgeboard Connectors Feature Summary

• Vertical orientation design for direct board insertion
• Dual-edge compatibility for high-density signal routing
• Gold-plated contacts ensure reliable electrical performance

Edgeboard Connectors Applications

• High-speed data transmission backplanes
• Telecommunications equipment interconnects
• Industrial control system modules

Edgeboard Connectors Procurement Notes

Verify the specific package type availability, as distribution channels may list cut tape or reel options. Confirm that the vertical form factor matches the mechanical constraints of the target assembly. Ensure the supplier provides traceability documentation consistent with original manufacturing standards to maintain component integrity.

Edgeboard Connectors Selection Notes

Select this component when a dual-edge vertical interface with a 0.60mm pitch is required. Consider the 56-position count against available board space. Evaluate the gold plating thickness requirements for mating cycles. Verify thermal management needs relative to the operating temperature range specified for the housing material.

Edgeboard Connectors Part Context

This component belongs to the broader category of edgeboard connectors manufactured by TE Connectivity. It serves as a critical interface between circuit boards and backplanes in complex electronic systems. The design prioritizes signal integrity and mechanical stability in dense packaging environments typical of modern electronics.

Edgeboard Connectors Replacement Considerations

Cross-reference with other 56-position dual-edge receptacles from the same manufacturer family. Check for updated revision levels or pinout variations in successor models. Ensure mechanical footprint compatibility before substituting with generic equivalents.