2327679-8

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 2327679-8 is a vertical edgeboard receptacle assembly designed for high-density interconnect applications. This component features 56 positions arranged in a dual-row configuration, providing a robust connection interface for edge cards. The connector utilizes a precise 0.6 mm (0.024 inch) pitch to support compact board layouts while maintaining signal integrity. Constructed with a copper alloy contact system and gold plating, it ensures reliable electrical performance over extended operational cycles. The housing is manufactured from black liquid crystal polymer (LCP), offering excellent thermal stability and mechanical strength. Designed for surface-mount technology, the assembly facilitates automated pick-and-place manufacturing processes. It operates within a standard temperature range of -55°C to 105°C, making it suitable for demanding server and storage environments where space efficiency and durability are critical requirements.

Edgeboard Connectors Feature Summary

• Vertical orientation design enables compact board stacking and efficient use of panel space
• Gold-plated copper alloy contacts provide durable low-resistance electrical pathways
• Liquid crystal polymer insulation ensures high thermal resistance and dimensional stability
• Surface-mount termination supports automated high-volume production assembly

Edgeboard Connectors Applications

• Server backplane interconnections
• High-speed storage array modules
• Telecommunications network equipment
• Industrial control system boards

Edgeboard Connectors Procurement Notes

Verify the specific suffix designation against official TE Connectivity documentation to confirm exact plating thickness and material specifications. Ensure compatibility with existing PCB footprint designs and reflow soldering profiles. Confirm that the vertical mounting style aligns with mechanical enclosure constraints and mating card dimensions prior to final procurement authorization.

Edgeboard Connectors Selection Notes

Select this component when vertical profile constraints require minimal Z-axis height utilization. Consider the 0.6 mm pitch density for maximizing I/O count within limited board areas. Evaluate the LCP material properties for high-temperature processing requirements. Assess the dual-row configuration needs against available mating card edge widths and pin counts.

Edgeboard Connectors Part Context

This receptacle belongs to the Sliver 2.0 series, a protocol-agnostic high-speed connector family engineered for modern data center infrastructure. The series emphasizes miniaturization without compromising signal performance. Components in this line are optimized for multi-lane applications requiring consistent impedance control. The vertical form factor distinguishes these assemblies from horizontal variants, catering specifically to stackable module architectures prevalent in contemporary computing hardware.

Edgeboard Connectors Replacement Considerations

Cross-reference with part number 2327679-2 for alternative configurations within the same series. Verify mechanical fit and electrical parameters before substituting any similar TE Connectivity edge connectors.